Double sided/FR4/1.0mm/ Tg 170/ green solder mask
Base copper:1/1 oz
Surface treatment: HAL Pb free
Min trace width/space:0.50mm
Min hole size: 0.50mm
6L/FR4/1.6mm/ Tg 170/ differential impedance control
Base copper:H/H/H/H/H/H oz
Surface treatment: Immersion gold
Min trace width/space:0.15/0.15mm
Min hole size: 0.30mm
14 Layer/FR4/ 2.0mm/Tg 170/ immersion gold
Base copper:H/H/H/H/H/H/H/H/H/H/H/H/H/H oz
50 & 60 ohm single Ended
100 ohm differential impedance
Min Track/Width: 0.1/0.1mm
6 L/FR4/1.60mm/ Green solder mask/ Immersion gold
Base copper:H/1/1/1/1/H oz
50 ohm single ended impedance control
Min trace width/space: 0.2/0.2mm
Min hole size: 0.35mm
8 L/FR4/1.60mm/ Tg150/ Immersion gold/BGA
Base copper:H/H/H/H/H/H/H/H oz
50 ohm single ended impedance control
90 ohm differential impedance
Min trace width/space: 0.15/0.20mm
4 L/FR4/1.60mm/ Tg 135/ Immersion gold
Base copper:H/H/H/H oz
50 ohm single ended impedance control
Min trace width/space: 0.20/0.25mm
Min hole size: 0.40mm
6Layers/ FR4/1.6mm/green solder mask/ CTI>175
Base copper:1/1/1/1/1/1oz
Surface Treatment: Immersion Gold
Min trace width/space:0.20/0.20mm
Min hole size: 0.3mm
4 Layers/ FR4/2.4mm/Tg 150
Base copper:1/1/1/1oz
Surface Treatment: OSP
Min Trace Width/Gap: 0.20/0.25mm
Min hole size:0.40mm